Master’s Student Project or Dissertation Position Available: Next-Generation Encapsulation Materials for Wide-Bandgap and ultra-wide-bandgap Semiconductors

An immediate Master’s student project or dissertation position is available beginning September 2026  as part of a collaborative project with the National Research Council of Canada focused on developing encapsulation materials for wide-bandgap (WBG) and ultra-wide-bandgap (UWBG) applications. Preference will be given to candidates with prior experience in WBG or UWBG materials, encapsulation fabrication processes, silicone elastomers, or elastomer processing technologies. Due to the immediate nature of the opening, candidates with Canadian citizenship or permanent  residency will receive additional consideration.

Project Background:

The WBG and UWBG materials like Silicon Carbide (SiC) and Gallium Nitride (GaN) are driving a global revolution in semiconductor technology. By delivering higher breakdown voltages, lightning-fast switching speeds, and superior thermal tolerance, these materials drastically outperform traditional silicon. Today, they serve as the crucial backbone for:

  • High-voltage automotive architectures
  • Advanced Electric Vehicles (EVs)
  • Next-generation Artificial Intelligence (AI) chips
  • Resilient smart power grids and renewable energy

The Challenge:

To unlock the full, extreme performance potential of these WBG materials, they require advanced encapsulation systems. Traditional packaging fails under high thermal loads and intense electromagnetic fields. This project focuses on the development, optimization, and validation of well-suited, high-performance encapsulation materials to ensure the reliability and longevity of next-generation electronics.

Candidate Profile:

We are looking for a motivated student with the following background:

Field of Study:

Pursuing a Master’s degree in Materials Science, Chemical Engineering, Mechanical Engineering, Electrical Engineering, Semiconductor Physics, or a closely related discipline.

Key Interests:

 Passion for power electronics packaging, silicone elastomers, polymer chemistry, composite materials, or hardware reliability.

Skills: 

Hands-on laboratory experience in silicone elastomers processing, power electronics packaging, etc.

What We Offer:

  • UofT Msc  fellowship
  • Cutting Edge Research: Work at the forefront of the green energy and electric vehicle revolution.
  • State-of-the-Art Infrastructure: Full access to high-end processing and reliability testing labs.
  • Expert Mentorship: Direct supervision and collaboration with the University of Toronto and National Research Council of Canada experts.

How to Apply:

Are you ready to shape the future of power electronics? Please submit your application as a single PDF that includes a brief cover letter outlining your interest in this project (1 page), your resume, and your most recent academic transcripts, and send it to Prof. Mohini Sain-   m.sain@utoronto.ca    before August 15, 2026